• MT62F2G64D8EK-023 AUT:B
  • MT62F2G64D8EK-023 AUT:B

MT62F2G64D8EK-023 AUT:B

No.Micron memory chip
Date code: 25+
Micron 128Gb Automotive LPDDR5 SDRAM

The MT62F2G64D8EK-023 is a high-performance, low-power DDR5 (LPDDR5) synchronous dynamic random-access memory (SDRAM) designed specifically for automotive applications. It offers a high density of 128Gb (16GB) and operates at a data rate of 7500 MT/s, making it suitable for bandwidth-intensive tasks such as autonomous driving, AI processing, and advanced digital cockpits.
  environments (typically -40°C to +105°C).
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  • MT62F2G64D8EK-023 AUT:B

Description

Based on the part number MT62F2G64D8EK-023 AUT:B, here is the functional description in English.
📝 Product Overview
Micron 128Gb Automotive LPDDR5 SDRAM
The MT62F2G64D8EK-023 is a high-performance, low-power DDR5 (LPDDR5) synchronous dynamic random-access memory (SDRAM) designed specifically for automotive applications. It offers a high density of 128Gb (16GB) and operates at a data rate of 7500 MT/s, making it suitable for bandwidth-intensive tasks such as autonomous driving, AI processing, and advanced digital cockpits.
The "AUT" designation confirms that this component is Automotive Grade, qualified to operate reliably in harsh thermal environments (typically -40°C to +105°C).
🔑 Key Functional Specifications
Device Type: LPDDR5 SDRAM (Low Power DDR5)
Memory Density: 128Gb (Gigabits) / 16GB (Gigabytes)
Organization: 2Gb x64
The component is organized as a x64 interface, providing a wide data bus for high-speed access.
Note: The "2G64" indicates a logical depth of 2 Gigabits per data pin.
Speed Grade: 7500 MT/s (Megatransfers per second)
The suffix "023" identifies this specific speed bin, which corresponds to a clock frequency (FCK) of 3750 MHz.
Operating Voltage: 1.05V (VDD / VDDQ)
Optimized for low power consumption to reduce thermal load in enclosed automotive systems.
Temperature Range: -40°C to +105°C
Qualified for automotive environments.
Package: 441-ball TFBGA (Thin Fine-Pitch Ball Grid Array)
Dimensions: 14.0mm x 14.0mm.
Ball Pitch: 0.5mm.
⚙️ Functional Features
High-Speed Interface: Utilizes a source-synchronous data clocking scheme to achieve 7500 MT/s bandwidth.
On-Die ECC: Includes internal Error Correction Code logic to detect and correct single-bit errors, enhancing data reliability and supporting functional safety requirements (ISO 26262).
Decision Feedback Equalization (DFE): Integrated on the data receiver to compensate for signal degradation at high frequencies.
Bank Groups: The memory array is divided into multiple bank groups, allowing for interleaved operations and improved efficiency.
Self-Refresh & Power Saving: Supports deep power-down modes and self-refresh to maintain data integrity while minimizing power consumption during idle states.
🚗 Typical Applications
ADAS (Advanced Driver Assistance Systems): Processing video feeds from multiple cameras and data from LiDAR/Radar sensors.
Automotive Infotainment: Driving high-resolution displays and running complex operating systems (e.g., Android Automotive, QNX).
Digital Cockpits: Integrating instrument clusters, navigation, and entertainment into a single domain controller.
Autonomous Driving Compute Platforms: Storing map data and running neural network inference models.
Note on Revision: The suffix "AUT:B" indicates the Automotive Grade temperature range and Revision B of the silicon. This revision code is critical for ensuring compatibility and traceability in automotive manufacturing.