• MT62F2G32D4DS-026 WT:C
  • MT62F2G32D4DS-026 WT:C

MT62F2G32D4DS-026 WT:C

No.Micron memory chip
Date code: 25+
Micron 64Gb LPDDR5 SDRAM (Low Power Double Data Rate 5)
This component is a 64 Gigabit (8GB) LPDDR5 DRAM chip. It is designed for high-end mobile and embedded applications requiring large memory capacity and high data throughput. It features a x32 interface and operates at high speeds.
Device Type: LPDDR5 SDRAM (Low Power DDR5)
Density: 64Gb (Gigabits) / 8GB (Gigabytes)
Organization: 2Gb x32
$66.87
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  • MT62F2G32D4DS-026 WT:C

Description

Based on the part number MT62F2G32D4DS-026 WT:C, this component is a high-density, high-performance memory module manufactured by Micron Technology.
The code "WT" indicates that this is a standard commercial/industrial grade component (distinct from the automotive "AAT" or "AUT" grades), designed for general high-performance applications.
Here is the functional description in English:
📝 Product Description
Micron 64Gb LPDDR5 SDRAM (Low Power Double Data Rate 5)
This component is a 64 Gigabit (8GB) LPDDR5 DRAM chip. It is designed for high-end mobile and embedded applications requiring large memory capacity and high data throughput. It features a x32 interface and operates at high speeds.
🔑 Key Specifications & Features
Device Type: LPDDR5 SDRAM (Low Power DDR5)
Density: 64Gb (Gigabits) / 8GB (Gigabytes)
Organization: 2Gb x32
The "2G32" indicates a memory depth of 2 Gigabits with a 32-bit data bus width.
Speed / Data Rate: The suffix "026" typically indicates a data rate of 7500 MT/s (Megatransfers per second).
Note: This is a high-performance speed bin, faster than the standard 6400 MT/s.
Package: FBGA (Fine Pitch Ball Grid Array)
Likely a 200-ball package, standard for x32 LPDDR5 devices.
Voltage: Low voltage operation (VDD/VDDQ typically 1.05V / 0.5V) to ensure energy efficiency.
Key Technologies:
On-die ECC: Internal error correction for data reliability.
DFE (Decision Feedback Equalization): Ensures signal integrity at high data rates (7500 MT/s).
WCK2CK Training: Optimizes timing for high-speed operation.
💡 Typical Applications
Flagship Smartphones: High-end mobile devices requiring large memory capacity (8GB) for multitasking and gaming.
Tablets & Laptops: Devices used for content creation or professional applications.
High-Performance Computing: Embedded systems requiring fast data access.
AR/VR Devices: Headsets requiring rapid rendering and data buffering.
Note: The "WT:C" refers to the Wafer Trace or Revision code (Revision C). This identifies the specific manufacturing lot or silicon revision, which is critical for traceability and quality control in the supply chain.