Description
Based on the part number MT62F2G32D4DS-026 WT:B, this component is a high-performance memory module manufactured by Micron Technology.
The code "WT" signifies that this is a Commercial/Industrial Grade component, designed for standard temperature environments. This chip is a 64 Gigabit (8GB) LPDDR5 DRAM, widely used in high-end consumer electronics that require fast data processing and multitasking capabilities.
Here is the functional description in English:
📝 Product Description
Micron 64Gb Commercial LPDDR5 SDRAM
This component is a 64 Gigabit (8GB) LPDDR5 DRAM chip. It is designed for flagship mobile devices and computing platforms that demand high bandwidth and power efficiency. It features a x32 interface and operates at a speed of 6400 MT/s, making it suitable for advanced gaming, AI processing, and high-resolution media applications.
🔑 Key Specifications & Features
Device Type: LPDDR5 SDRAM (Low Power DDR5) – Commercial Grade
Density: 64Gb (Gigabits) / 8GB (Gigabytes)
Organization: 2Gb x32
The "2G32" indicates a memory depth of 2 Gigabits with a 32-bit data bus width.
Note: This density typically utilizes Micron's advanced 16Gb die technology (4 internal dies of 2Gb each).
Speed / Data Rate: The suffix "026" indicates a data rate of 6400 MT/s (Megatransfers per second).
Note: This is a standard high-performance speed bin for LPDDR5, offering significantly faster bandwidth than LPDDR4X memory.
Temperature Range: Commercial/Industrial temperature range (typically -40°C to +85°C).
Note: The "WT" designation indicates it is not rated for the extended automotive temperature range (-40°C to +105°C).
Compliance:
JEDEC Standard: Compliant with industry-standard LPDDR5 specifications.
Package: FBGA (Fine Pitch Ball Grid Array)
The "DS" package code indicates a specific package type (likely 315-ball) designed to accommodate the internal stacking required for this density while maintaining the x32 interface.
Key Technologies:
On-die ECC: Internal error correction, crucial for maintaining data integrity in high-density chips.
DFE (Decision Feedback Equalization): Ensures signal integrity at high data rates (6400 MT/s).
Self-Refresh Modes: Optimized for low power consumption to extend battery life in mobile devices.
💡 Typical Applications
Flagship Smartphones: High-end mobile devices requiring 8GB-16GB of RAM for advanced gaming and AI features.
High-Performance Laptops: Ultrabooks and mobile workstations requiring efficient, high-capacity memory.
AR/VR Headsets: Devices requiring high bandwidth and large frame buffers for immersive experiences.
Tablets: Premium tablets used for content creation and media consumption.
Note: The "WT:B" refers to the Commercial Trace or Revision code (Revision B). This identifies the specific manufacturing lot or silicon revision, which is critical for traceability and quality control in commercial supply chains.
