• MT62F1G32D2DS-023 AAT:C
  • MT62F1G32D2DS-023 AAT:C

MT62F1G32D2DS-023 AAT:C

No.Micron memory chip
Date code: 25+
Part Number    MT62F1G32D2DS-023 AAT:C

Manufacturer    Micron Technology
Memory Type    LPDDR5 SDRAM
Capacity    4GB (32Gb)
Organization    x32 (1 Gig x 32)
Speed Grade    023 (Indicates specific timing/speed bin, typically 6400 Mbps class)
Temperature    -40°C to +105°C (Automotive Grade)
Package    FBGA (Fine-pitch Ball Grid Array)|
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  • MT62F1G32D2DS-023 AAT:C

Description

The MT62F1G32D2DS-023 AAT:C is a 4GB (32Gb) LPDDR5 SDRAM component. The "MT62F" series denotes Micron's advanced LPDDR5 technology, which delivers significantly faster data rates and better power efficiency compared to LPDDR4x. The "AAT" suffix indicates it is rated for Automotive temperature ranges, ensuring reliability in harsh environments.
🚀 Key Functional Description
High Density & Organization: This device features a 4GB (32Gb) capacity with a x32 bit interface width. The "1G32" organization (1 Gig x 32) allows for efficient memory management in complex systems.
LPDDR5 High-Speed Performance: It operates on the LPDDR5 standard, supporting high data transfer rates (typically up to 6400 Mbps). This high bandwidth is essential for 5G connectivity, AI processing, and high-resolution graphics rendering.
Power Efficiency: LPDDR5 technology reduces power consumption by approximately 20% compared to LPDDR4x through features like dynamic voltage scaling and improved refresh mechanisms. This helps extend battery life in portable devices.
Automotive Grade Reliability: The "AAT" (Automotive Temperature) designation certifies the component for operation typically between -40°C to +105°C. This ensures stability and data integrity in demanding automotive applications, such as digital cockpits and ADAS.
📋 Technical Specifications Summary
Feature    Specification
Part Number    MT62F1G32D2DS-023 AAT:C
Manufacturer    Micron Technology
Memory Type    LPDDR5 SDRAM
Capacity    4GB (32Gb)
Organization    x32 (1 Gig x 32)
Speed Grade    023 (Indicates specific timing/speed bin, typically 6400 Mbps class)
Temperature    -40°C to +105°C (Automotive Grade)
Package    FBGA (Fine-pitch Ball Grid Array)
💡 Typical Applications
Automotive Digital Cockpits: Powering instrument clusters, infotainment systems, and heads-up displays (HUD).
5G Smartphones: Handling high-speed data processing and multitasking for flagship mobile devices.
ADAS (Advanced Driver Assistance Systems): Buffering real-time sensor data for autonomous driving features.
Edge AI & IoT: Supporting machine learning inference at the edge with low latency.