Description
Active, Read, Write, Precharge, Auto‑Refresh, Self‑Refresh
Burst lengths: BL16, BL32 (programmable and on‑the‑fly)
Partial‑Array Self‑Refresh (PASR)
Temperature‑compensated self‑refresh (controlled by on‑chip temperature sensor)
Directed per‑bank refresh for concurrent bank operation
Clock stop and deep power‑down modes
Built‑in signal integrity and reliability features:
On‑die termination (ODT, programmable VSS termination)
Selectable output drive strength
Data bus inversion (DBI)
Bidirectional/differential data strobe per byte lane
Single‑ended CK and DQS support
Automotive qualification: AEC‑Q100 Grade 2 compliant.
Operating temperature range: -40°C to +105°C (AAT automotive grade).
Package: 200‑ball TFBGA (10 × 14.5 mm, Ø0.40 SMD) surface‑mount package.
Short 1‑line Description
16Gb automotive LPDDR4X/LPDDR4 SDRAM, 512M×32, single‑die, 4266 MT/s, 0.6V/1.1V/1.8V, 200‑TFBGA, -40°C to +105°C, AEC‑Q100 qualified for automotive ADAS and infotainment.