Description
Device Type DDR4 SDRAM (Synchronous Dynamic Random-Access Memory)
Product Grade Industrial Temperature (IT) -Density 8Gb (Gigabit) - 512 Megabyte x 16 configuration
Organization 512M x 16 (512 Megabit word × 16-bit width)
Package 96-ball FBGA (Fine-pitch Ball Grid Array)
Speed Grade -062E (DDR4-3200, 3200 MT/s)
Voltage 1.2V VDD / 1.2V VDDQ
Temperature Range Industrial: -40°C to +95°C (TC) 105°C
Features • x16 data width configuration• 8 internal banks (2 groups of 4 banks each)• Burst Length: 8 (BL8) and Burst Chop: 4 (BC4)• On-Die Termination (ODT)• Temperature sensor with automatic refresh control• Data Bus Inversion (DBI)• Command/Address Parity (CA Parity)• Write Cyclic Redundancy Check (CRC)• Fine granularity refresh (FGR)• Target Row Refresh (TRR)• Write leveling• Multi-purpose register (MPR)• Enhanced thermal characteristics for industrial applications
