Description
Programmable data strobe preambles and preamble training
Command/Address Latency (CAL) and multipurpose register read/write capability
Write leveling, self‑refresh, and Low‑Power Auto Self‑Refresh (LPASR)
Temperature‑Controlled Refresh (TCR), fine‑granularity refresh, and self‑refresh abort
Nominal, park, and dynamic On‑Die Termination (ODT)
Data Bus Inversion (DBI) and Per‑DRAM Addressability (PDA)
Compliance with JEDEC JESD‑79‑4 standards
96‑ball FBGA package (9mm × 13mm, Pb‑free)
Commercial operating temperature range: 0°C to +95°C
TR suffix indicates tape‑and‑reel packaging for automated assembly
The marking :E denotes Micron’s internal revision and quality control code, ensuring production traceability and reliability. This device is optimized for high‑bandwidth, low‑power applications including embedded systems, industrial computing, and consumer electronics.